Looking to maximize your multi-string inverters’ power density and performance? Then your search ends with our 300+ kVA flowANPC S3. Combining 950 V fast Si IGBTs with 1200 V SiC diodes, these hybrid modules are engineered to cut per kW costs and boost your customers’ ROI.
The chipset is optimized for a maximum efficiency at high power factors, enhancing the performance in inverter operation. The LQ79/89 enables smaller and therefore lighter passive components, and combined with the advanced die attach technology, longer lifetime is now possible.
300+ kVA for higher power density, lower cost
Advanced die-attach technology for longer lifetime or higher power from the same footprint
Optimized chipset for greater efficiency, better ROI
flow S3 mid-power package for smaller, lighter passive components
Samples of the flowANPC S3 Split modules are available through our usual channels.
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